![]() I/O wire / area density for higher data bandwidth Packaging architectures have been deployed to increase Interconnect density limit with increased bandwidth and The focus toĮnable heterogeneous integration scaling is to push Important performance enabler as high-performanceĬomputing (HPC) demands continue to rise. | Yue Deng, Xike Zhao, Liang He, David Wright, Hossein Madanipour, Bret Halbe, Jung Kyu, Fred Tarazi, Gang Duan, Dror Trifon, Rahul Manepalli, David Heller Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Having pioneered full convection reflow -now the standard of the industry - we have met, and continue to accept, major engineering challenges. ![]() In the course of responding to forces that impel electronics assemblers to reduce their product development cycles, Heller has amassed considerable expertise in resolving reflow and curing issues. Since we introduced our first full convection reflow oven in 1987, Heller Industries has brought innovations and refinements to market at an accelerating rate. This shared experience provides support in executing the company's various functions: assembly, design, service or quality assurance. Our entire staff is grounded in engineering principles. The cohesive management team ensures valuable continuity the people you speak with today have a heritage and a future with the company. Our company-wide ISO 9001 program enhances communication within and among departments - as well as throughout our global network of regional managers, sales representatives, field service engineers and customers. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise over the past 42 years. Heller Industries Corporate Video Heller Industries, the market leader in Reflow Soldering technology, supplies solutions for electronics manufacturers and assemblers worldwide.Īdvanced manufacturing and production systems that supply both standard and special reflow ovens cost-efficiently, with rapid delivery.
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